The basic concept underlying the BST
technology is shown in figure 1 and consists of associating a dedicated test cell to each
functional pin. These test cells are the Boundary Scan cells and their main
function consists of decoupling the internal logic from the IC pins, allowing the
application of the required logic values at the cell outputs, regardless of the
values present at their inputs. It therefore becomes possible to:
- Apply any combination to the IC output pins and
to the IC internal logic inputs (through the parallel output of the BS
cells).
- Capture the values present at the IC input pins
and at the internal logic outputs (through the parallel input of the BS
cells).
The serial input of each
cell is connected to the serial output of the previous cell within each IC, forming an
internal chain known as the Boundary Scan Register. Since all BS registers may be
daisy-chained at PCB level, as suggested in figure 1, direct access to any BS pin is now
possible, without requiring physical access to internal PCB nodes.
Figure 1: The basic concept underlying the BST technology.
Figure 1 also suggests that additional
resources are required in each IC to control the operating mode of the BS cells, leading
to a dedicated set of test pins known as the Test Access Port (TAP). This TAP
includes 4 pins with the following characteristics, as defined in the IEEE 1149.1
std:
- TDI (Test Data Input): The serial data input to
the BS register. When floating, this pin produces a response identical to the application
of a logic 1.
- TDO (Test Data Output): The serial data output
of the BS register. This is the only output pin in the TAP and must be in the
high-impedance state except when a scan operation is in progress.
- TCK (Test Clock): The clock signal for the test logic.
- TMS (Test Mode Select): A control input that
defines the operating mode required for the test logic. When floating, this pin produces a
response identical to the application of a logic 1.
Optionally, a fifth pin may be present
for initialisation purposes (the /TRST ¾ Test Reset, active low ¾ pin). The complete BS
architecture may in fact be represented as shown in figure 2, which brings into evidence
the following main features:
- The TDI-TDO path goes through two multiplexers,
a n:1 "Data multiplexer" and a 2:1 "Data / Instruction multiplexer".
- The 2:1 data / instruction multiplexer is
controlled by an output of the "TAP controller" block (which is a small finite
state machine controlled by the external input TMS) and selects the TDI-TDO path through
the "Instruction register" or one of the "Data registers"
(one of
which is the BS register).
- The n:1 data multiplexer is controlled by the
contents of the instruction register (through a decoder block called the "Instruction
decoder") and selects which of the data registers is to be routed to the TDO output,
through the data instruction multiplexer.
Figure 2: The BS architecture at IC level.
Access to this BS architecture is
controlled by the sequence of logic values applied to the TMS input and may be summarised
as follows:
- The TAP controller output connected to the data
/ instruction multiplexer places the instruction register in the TDI-TDO
path.
- The proper bit sequence (instruction) is
shifted in, setting the contents of the instruction register with the code that selects
the required data register (by controlling the n:1 data multiplexer).
- The TAP controller output connected to the data
/ instruction multiplexer places the selected data register in the TDI-TDO
path.
- Test vectors may now be shifted in and out
through the selected test data register.
However, and before a block-level
analysis of the architecture shown in figure 2 takes place, the basic functional
requirements that must be satisfied by the BS cells will be detailed in the following
section.
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